Ming-Chi Kuo noted that ASML is in rumors to increase the price of its chip-making tools for TSMC. But that won’t be the exact case. Perhaps, the Taiwanese semiconductor firm will likely bargain with ASML and suppress it for price reductions.

TSMC is one of the biggest customers of ASML. The latter used to sell large lithography machines to the former to print circuit patterns onto silicon wafers.

Wall Street stated a few points that hint at why ASML could raise the price of its chip equipment for TSMC. Firstly, ASML has planned to achieve €30 to €40 billion in revenue range by 2025. The firm is taking new steps to enhance its sales by next year.

Secondly, TSMC and other customers of the Dutch chip equipment supplier are looking forward to more advanced chipmaking processes by next year. This may ultimately increase the demand for ASML’s highest-end EUV tools pricing €350 million.

Lastly, ASML is seeing a major decline in semiconductor stocks for the time being. Customers like Intel and Samsung didn’t make much progress. But TSMC has recently reported blockbuster earnings with 54% profit. This could be a reason to hike chip equipment prices for the Taiwanese semiconductor firm.

TSMC is highly dependent on ASML for chipmaking tools. Thus, the Dutch firm could take advantage of this point to some extent by raising its price. However, the U.S. government may subsidize this dealing with better profits on both sides.

Note that neither ASML nor TSMC has confirmed this news so far. Hence, it is better to take this rumor with a grain of salt at present.

ASML rumored to increase chip-making tool price for TSMC (Image Credits: ASML)

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According to the information, TSMC’s 3nm process technologies bring performance improvement, better power management, and yield rate. In terms of numbers, the 3nm technology currently offers as much as 18% speed improvements at the same power input as its predecessor and up to 60% increment in logic density.

MediaTek also hailed its partnership with Taiwan’s TSMC and said that both firms have collaborated to make a high-performance chip.

“We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek.

“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC.

MediaTek announced that the first 3nm Dimensity flagship chip will be used in smartphones, tablets, smart cars, and various other devices starting in the second half of 2024.

(source – MediaTek)

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Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging. Advanced packaging allows multiple devices (electrical, mechanical, or semiconductor) to be merged and packaged as a single electronic device.

Unlike traditional integrated circuit packaging, advanced packaging employs processes and techniques that are performed at semiconductor fabrication facilities.

Advanced packaging can help achieve performance gains through the integration of several devices in one package and associated efficiency gains (by reducing the distances signals have to travel.

In other words reducing signal paths), and allowing for high numbers of connections between devices, without having to resort to smaller transistors which have become increasingly more difficult to manufacture.

(via – Digitimes)

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According to the information, the latest move from TSMC aims to get huge state support for the $11 billion plant as the EU looking to boost the supply chain of important products.

The European Union has approved the European Chips Act, a 43 billion euro subsidy plan to double its chipmaking capacity by 2030. This is an effort to catch up with Asia and the US after shortages and high prices during the COVID-19 pandemic created havoc for the continent’s carmakers and machine builders.

Both TSMC and Germany have been pursuing conversations to establish a new chip company in the country since 2021. The host will give away up to 5 billion euros in support to form the factory in Dresden, capital of the eastern state of Saxony.

“Germany is now probably becoming the major location for semiconductor production in Europe,” German Chancellor Olaf Scholz said, less than two months after Intel announced a 30 billion euro plan to build two chip-making plants in the country.

“That is important for the resilience of production structures around the world, but it is also important for the future viability of our European continent, and it is of course particularly important for the future viability of Germany.”

(source)

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The aim of this research and development facility is to harness chipset processing technology of 2nm and beyond. According to the information, the new TSMC R&D center initially hosted 2000 engineers and this capacity is aimed to increase to 7000 by September.

TSMC chairman Mark Liu said that the company is focused on advanced chip technologies and will be more proactive in developing world-leading semiconductor technologies from 2-nanometer technology.

The company also projects that 2nm tech would be popular by 2025 and follow the success of 3nm in the industry. TSMC is also counting Apple and Nvidia as its major customers.

Talking about investment, TSMC is continuously increasing its R&D fund. Last year, TSMC spent 30 percent more on R&D, totaling US$5.47 billion, compared with US$4.47 billion in 2021.

Overseas development:

Amid this grand opening, TSMC keeps on expanding its chipset manufacturing plant in overseas markets. Recently, the chip maker announced a 28nm plant in Germany. However, this move sparked some questions over TSMC the company will halt in-house manufacturing. But the chip manufacturer now denied all of these allegations with this new R&D facility.

(source – taipeitimes)

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According to a report from Taiwanese media, experts in the study of semiconductors revealed that the current 3nm yield rate is estimated to be about 60% to 70%, or even more than 70%.

Another multinational industry analyst estimated that the current yield rate of TSMC’s 3nm process may fall to about 75%-80%. “There has been such progress in the early stage, which is very impressive.”

The latest input suggests that TSMC has taken the lead in 3nm chip orders and rip off most of the orders from Samsung. In June 2022, Samsung became the first foundry business to announce the initial production of its 3nm process node.

At that time, Samsung’s 3nm yield rate was less than 20 percent and some wafers even had a yield rate of only 10 percent. An industry analyst says, Samsung actually doesn’t know where the fault is.

TSMC says its 3nm process is the most advanced semiconductor technology in both power, performance, and area (PPA). In transistor technology, and a full-node advance from the 5nm generation.

Compared to the 5nm (N5) process, the 3nm process offers up to 1.6X logic density gain and 30-35% power reduction at the same speed and supports the innovative TSMC FINFLEX architecture.

Apple, MediaTek, and Qualcomm:

After Huawei HiSilicon‘s exit, TSMC’s market share was reduced because it was one of the biggest chip customers.

Still, Apple, MediaTek, Qualcomm, AMD, and Nvidia are the top customer of TSMC and Samsung Foundry business. These clients require various chip nodes throughout the year. While, Apple may still be the first to use a 3nm chipset for next year’s iPhones, followed by Qualcomm and MediaTek.

TSMC announced that it is also preparing for 2nm fabs, which will be upgraded six times than the last node process.

Samsung needs to improve:

TSMC is a long-standing chipset printer and Samsung needs to improve its Foundry business to compete against it. That’s all to suggest for the South Korean company.

(source)

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The previously shared HiSilicon Tinaguang 800 chip image shows that the chip is printed with the HiSilicon logo and has coded text at the bottom. It was also reported that it may be a GPU and could launch this year.

Talking about the tipster, whistleblower@Fox Place MU Ling is said to be an employee of Huawei that’s why some users believe that this information is very reliable. Now, the Huawei executives have personally denied this news. It looks like this news is actually a rollover.

According to the previous information, , the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.

Huawei HiSilicon:

On January 1, 2022, Huawei Kirin gives New Year wishes and stated mentioned, in 2022 continue to set off and move towards the chip. It clearly hints that there could be a new breakthrough waiting for us to unravel in the coming year and we might see a new Kirin processor soon.

In May 2019, the U.S government black-listed Huawei and restricts the U.S based companies to supply components. Since then, the Chinese tech maker is facing issues and a shortage of components.

During this timeline, Huawei is working hard to overcome this situation and find alternatives to get rid of component shortages. It was also reported that the Chinese tech maker will soon take a big move in 2022 that it will a permanent solution for the component shortage.

(Source: ithome)

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This image of this upcoming chipset was shared by a tipster with the caption Huawei HiSilicon Tinaguage 800 chip. By inspecting the chip, it is noted that the chip is actually printed with the HiSilicon logo and has coded text at the bottom.

HiSilicon Tianguang 800 chip:

Huawei HiSilicon’s upcoming HiSilicon Tianguang 800 chip could be a powerful GPU, which is unknown at the moment. Also, the word “Tianguang” refers to comes from the Taoist “Zhuangzhi Gengsangchu”, the original text being “Yutai Ding, emerging from the sky”, referring to the natural light of wisdom.

Huawei HiSilicon:

Since 2019, Huawei and its semiconductor subsidiary HiSilicon is facing a lot of issues and continuously working hard to overcome them. On January 1, Huawei Kirin welcome 202 and said that the technology will be more refined in the future.

On the other hand, Huawei HiSilicon has launched chips, and last year, it released HiSilicon’s Image Processing Engine (ISP) to achieve deep integration of image quality technology and AI technology.

Last December, at the 3rd China Semiconductor Investment Alliance Annual Conference and China IC Billboard Awards Ceremony the “Top 100 Chinese Semiconductor Companies” list was announced in which Huawei HiSilicon is listed on the top position.

(Via: ithome)

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In addition to this, a report also mentioned at the industry exhibition in Taiwan, the relevant personnel of Huawei and TSMC’s supply chain partners was spotted discussing the equipment purchase for the factory. It is disclosed that SMIC Southern and local government funding and other details.

Regarding this, a person familiar with this matter from Huawei told Chinese media that above the news was false. Meanwhile, several people close to SMIC also mentioned that SMIC never participated in this and assisted Huawei in building any factories.

However, the cooperation between the two parties was a legal and regulatory business activity only at the foundry level, not external, conceived the development of “grouping and warming”.

SMIC and Huawei:

SMIC is the largest wafer fab and contract chip maker in mainland China. To restrict these firms, the US government listed them on the “entity list” and targeted sanctions policies are increasingly being implemented. Since then, Huawei is facing a shortage of core components and finding solutions to overcome them.

So far, Huawei and its allies have been banned from all U.S, which prohibits the companies from purchasing goods made with the country’s manufacturer or supported technologies.

Therefore, SMIC must be licensed to import required components. It is also necessary to apply to the Department of Commerce for advanced technology nodes (10 nanometers or less), direct export of essential goods required for the production of semiconductors will be restricted.

China’s independent supply chain system is still difficult to meet the requirements of Huawei and SMIC. Therefore, the two companies’ operations still need to be enforced in the United States to import certain key products, materials, and equipment.

So, a person familiar with the matter pointed out that, in fact, SMIC and Huawei have maintained long-term and effective communications with the US Department of Commerce, and the two companies have never thought of working behind closed doors.

Even under extreme pressure, Huawei founder Ren Zhengfei has repeatedly stated publicly that Huawei will be more determined to cooperate with US companies and maintain an open attitude. SMIC co-CEO Zhao Haijun once explicitly stated in a financial report briefing that SMIC has maintained a stable cooperative relationship with US suppliers for the past 20 years. Therefore, a large number of US suppliers are the first choice of SMIC.

After getting banned, SMIC and suppliers actively applied for permits for the first time, and the supplier is also updating the progress of permit applications by fab makers. On another level, Huawei and SMIC are among the few domestic semiconductor companies that insist on taking an international route to serve customers around the world.

Among them, SMIC not only helps in the development of domestic design companies but also provides support for the local production of many major international companies. At the same time, in recent years, SMIC, including Beijing, Shanghai, Shenzhen, and many other places, has launched new capacity projects focusing on 28 nanometers and above, and it is impossible for the customer to stop its progress.

If both sides try to break the technical blockade of the United States through cooperation in building factories, this could lead to further sanctions in the United States. Therefore, it is advisable to adopt this method to jeopardize the security of both parties in the operation of the company.

(Via: ithome)

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The Huawei Kirin welcomed 2022 and said that this technology will be more refined in the future. In addition to this, the company throws the light on the success and progress made by the Kirin chipset in the market.

Past achievements:

Kirin 9000 has been the world’s first 5nm Kirin 9000 processor that won the “Annual Strongest 5G Mobile Device Chip” award issued by Communications World (CWW).

In January 2021, China Mobile’s 2020 Smart Hardware Quality Report (Phase 2) and 5G Communication Index Report (Phase 3) announced Kirin 9000 as a winner of:

1. 5G Chip Excellence Award, 5G Chip Comprehensive Evaluation No.1
2. 5G Mobile Communications Index (Phase 3) Ranking No.1
3. 5G Mobile Comprehensive Evaluation Top Ranking List No.1

The chipset has won No.1. in various assessments, the leading strength is recognized by the executives.

In February, Huawei launched the Huawei Mate X2 foldable phone that comes with a new chipset and brings a new kind of foldable phone user experience.

That’s not it, the Huawei P50 Pro has also been boosted with the 4G variant of Kirin 9000 and it’s have been very successful due to the improved Kirin architecture.

U.S. Sanctions:

Since May 2019, Huawei has been serving U.S. sanctions on all imports of products including chipset and other required components to make new products. On the other hand, it cannot access Google Mobile Services (GMS) as well as other Google apps that won’t be found in Huawei phones nowadays.

Following the ban, Huawei cannot print new Kirin chipsets via chipmakers such as TSMC and Samsung foundry. Therefore, it is facing a shortage of important processors to build new devices.

(via – ithome)

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