Ming-Chi Kuo noted that ASML is in rumors to increase the price of its chip-making tools for TSMC. But that won’t be the exact case. Perhaps, the Taiwanese semiconductor firm will likely bargain with ASML and suppress it for price reductions.

TSMC is one of the biggest customers of ASML. The latter used to sell large lithography machines to the former to print circuit patterns onto silicon wafers.

Wall Street stated a few points that hint at why ASML could raise the price of its chip equipment for TSMC. Firstly, ASML has planned to achieve €30 to €40 billion in revenue range by 2025. The firm is taking new steps to enhance its sales by next year.

Secondly, TSMC and other customers of the Dutch chip equipment supplier are looking forward to more advanced chipmaking processes by next year. This may ultimately increase the demand for ASML’s highest-end EUV tools pricing €350 million.

Lastly, ASML is seeing a major decline in semiconductor stocks for the time being. Customers like Intel and Samsung didn’t make much progress. But TSMC has recently reported blockbuster earnings with 54% profit. This could be a reason to hike chip equipment prices for the Taiwanese semiconductor firm.

TSMC is highly dependent on ASML for chipmaking tools. Thus, the Dutch firm could take advantage of this point to some extent by raising its price. However, the U.S. government may subsidize this dealing with better profits on both sides.

Note that neither ASML nor TSMC has confirmed this news so far. Hence, it is better to take this rumor with a grain of salt at present.

ASML rumored to increase chip-making tool price for TSMC (Image Credits: ASML)

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Huawei is unable to access high-end chipmaking tools due to U.S. sanctions. Now the foreign authorities are planning more challenges for the company in semiconductor manufacturing. They are pressing Biden to impose more restrictions.

Chairman John Moolenaar and Ranking Member Raja Krishnamoorthi – the members of the House Select Committee on strategic conflicts between the U.S. and China, recently wrote a letter to Gina Raimondo (Commerce Secretary) on Chinese tech progress concerns.

The letter highlights that the Biden administration should increase export controls to block Huawei’s secretive chip network growth. The “clandestine semiconductor facilities” of Huawei will ultimately harm U.S. security on a large scale.

“…Just as you have taken steps to prohibit Huawei from purchasing U.S. chips, it is similarly important and logical to restrict the flow of SME to prevent Huawei from fabricating its chips. Restricting the flow… will send an important signal to… Huawei that the United States will take action to prevent U.S. technology from enabling its problematic technology ambitions.” (via)

According to Bloomberg, Huawei is currently teaming up with Pengxinxu, SwaySure Technology, and Qingdao SiEn to expand its chip network. These firms are free from U.S. restrictions and do not count in the Entity list.

US lawmakers urge tougher restrictions on Huawei chip tech: Report (Image Credits: Huawei)

Huawei also collaborated with the PXW Semiconductor to accelerate its chipmaking process. But later, the U.S. added the respective firm to the entity list, prohibiting it from accessing advanced technologies. Now they are planning the same treatment for the above-mentioned firms to block ways for Huawei.

The Commerce Department has said to respond on this matter soon with their appropriate mediums.

Huawei launched a 7nm chip last year which belongs to the SMIC foundry. Since then, the U.S. started eyeing the OEM for every step it takes in chipmaking.

The U.S. authorities canceled the licenses of many foreign semiconductor firms from selling chipsets or chipmaking equipment to Huawei. ASML is one of the major examples of this aspect. Now lawmakers are urging to ban 120+ Chinese companies and impose fresh restrictions on chip tool sales in China.

Apart from its own efforts, the U.S. is pressuring its neighboring countries to impose the same restrictions on China. Although they didn’t show much interest.

How Huawei will make its steps more firm in the chip tech field amid these US restrictions and export problems would be worth looking forward to.

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FixedFocus notes that the upcoming Huawei Kirin 9 series chip may have a “1+3+4” CPU architecture. It will use one self-developed large core, three medium cores, and 4 small cores. It could also use an improved 7nm Pro Plus chipset platform.

A self-developed large core implies better and higher performance. These cores can easily handle heavy tasks like gaming, video editing, and more. The medium and small cores maintain balance and ensure a reduction in power consumption.

7nm Pro Plus hints at a more enhanced chipset platform. Huawei has said to improve its existing 7nm technology rather than focusing on the new 5nm or 3nm ones. The 7nm Pro Plus refers to the company’s new improvements in chip making.

The leak also implies that the OEM may use 8, 6, and 4 channels as per the chipset yield. Here, channels refer to a separate path that enables the CPU to access memory. The number of channels in a processor helps it to interact with memory modules.

For instance, the Quad Channel has four channels to associate with the memory module. The “6-channel and 8-channel” mainly used for servers. A high number of channels also increases bandwidth and results in dynamic computing performance.

Some netizens predicted that Huawei may bring two new Kirin chips for its Mate 70 series. The standard Mate 70 model could use the new Kirin 9 chip. Meanwhile, the high-end variants will likely adopt a 5nm processor with upgraded performance.

The prediction might be accurate to some extent. Huawei has been long-rumored to develop new Kirin chipsets for its flagship products. It seems the processors are in the final development phase and could show up by the end of this year.

Other details about the new chipset such as its name, official parameters, and internal changes are still unknown. Although we will discover these inputs probably with the Mate 70 series launch, seemingly scheduled for November 2024.

New Huawei Kirin 9 chip may adopt ‘1+3+4’ 7nm CPU architecture (Image Credits: FixedFocus/Weibo)

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A Weibo tipster has shared the key specs of the Honor X60 Pro including display, battery, charging, and chip details. The leak also reveals the overall dimensions of the smartphone. It’s slightly thin and weighs less than the X50 Pro handset.

Compared to the standard model, the X60 Pro will sport a curved display of 6.78-inch. It will exhibit a resolution of 2700 x 1224 with impressive visual effects. The smartphone will measure 162.8 x 75.5 x 7.98mm and weighs 188 grams.

The device will likely equip the Snapdragon 6 Gen 1 processor. Its classic version will feature the Dimensity chipset with effective performance and efficiency.

Honor X60 Pro will pack a huge flagship-level 6600mAh battery and 66W fast charging. The battery life is of two days. Thus, users don’t have to stress about the device’s durability or concern about charging it daily to enjoy videos or music.

Leak reveals Honor X60 Pro display, battery, and chip details (Image Credits: Weibo)

Other than these specifications, the 12GB + 512GB storage variant of the Honor X60 Pro will likely support the Beidou satellite SMS feature. Users can stay in touch with their contacts even when their device is out of the cellular network.

The camera details are absent for the time being. But judging from the battery teaser, it seems Honor will adopt an upgraded lens setup with new imaging capabilities for the X60 series smartphones.

Honor X60 series is launching on October 16. Alongside, the company will unveil new tablets and some more interesting products. Get ready to witness a glorious evening next week.

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BeijingDigitalMaster notes that Huawei has significantly improved the smartphone chipmaking process. The overall Kirin efficiency is better than before.

The tipster further implied that the upcoming Huawei Kirin phones will likely deliver 30% better GPU performance. Its energy efficiency will also be much better than the previous versions, ensuring lower power consumption even during heavy tasks.

GPU stands for Graphics Processing Unit. It helps in generating high-quality images and makes app transitions faster. The component also enhances the CPU efficiency and speed of performing multiple operations such as gaming, rendering, and more.

Huawei currently uses the Maleoon 910 GPU for its devices which supports up to 4 CUs (Control Units) and 1024 ALUs (Arithmetic Logic Units). The company initially used this GPU with the Mate 60 series and continued with the other devices.

Future Huawei Kirin phones could offer 30% better GPU performance (Image Credits: Weibo)

As per the latest input, the company will optimize the GPU performance to a greater extent. Changes will likely be visible with the flagship Mate 70 series. Users might observe more efficiency while performing heavy tasks, playing games, or watching high-quality videos on the upcoming Huawei smartphones.

At the same time, the company is also enhancing the GPU power for its PCs. A previous leak suggested that Huawei is enhancing the GPU efficiency for its future notebooks.

Consumers may also find new AI services that will make their daily operations easier and more convenient. The company has recently launched the all-new MateBook GT 14 with a discrete GPU chip and the improvement could exceed to a new level with the upcoming PCs.

Let’s wait and see what new changes the company will add to its Kirin chips to deliver a better-than-before experience to users.

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A new leak suggests the uncertainty of the Kirin PC launch this year. Weibo tipster @BeijingDigitalMaster says that Huawei might delay the release of the Kirin PC chip by Q1 2025. And we have some reasons that justify the delay to some extent.

The Chinese OEM already has several major launches this year. For instance, this month will likely bring the Nova 13 series, a new MatePad tablet, the Sound X4, a smart Hi MateBook laptop, and of course, the HarmonyOS NEXT public beta program.

Next month is also seemingly full of big surprises like the stable HarmonyOS NEXT rollout, the flagship Mate 70 series, the Mate X6 dual-foldable phone, and more.

Huawei might have saved some interesting offerings for December as well. Thus, there are chances that the company may unveil its computer-dedicated software and chip in early 2025. Though the tech giant hasn’t mentioned any details on this matter.

Huawei Kirin PC chip might be delayed till Q1 2025 (Image Credits: Weibo)

A recent leak said that Huawei may launch the HarmonyOS PC in the next six months. Perhaps the company may debut the Kirin PC chip at the same time.

Early inputs predicted that the Kirin PC would follow the Apple M-series chip architecture. This framework includes all the main parts like DRAMs and SoCs in one package, doubling the memory bandwidth and performance efficiency. Read More… 

Apart from the new CPU architecture, the chipset is also expected to bring the latest AI features for notebooks, making them a smarter upgrade over previous versions.

The Kirin PC will also focus on better thermal control capabilities. Being the first self-developed laptop chip, it could be slightly less power efficient than the phone processors. Although Huawei may bring better changes in the time ahead.

You can check more news and details of the Kirin PC chip HERE.

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Tipster @FixedFocus says the next Kirin 9 series chip will have more stable and efficient small cores than previous versions. Huawei plans to use new self-developed small-performance cores for the upcoming processor with more power efficiency.

A smartphone or PC chip architecture mainly contains three types of cores: small, medium, and large. These cores perform specific tasks, making the chip performance efficient and productive. For instance, the small core is for power consumption.

Small cores are the most active cores in the chip and remain in the “Always-On” mode. These elements ensure that the device’s features like notifications and connectivity remain active even if the smartphone is in the low-power condition.

Also known as energy-efficient cores, these elements are responsible for lowering power consumption and maintaining background tasks or low-intensity workloads.

Huawei is now seemingly making these small cores more effective to boost the power efficiency of its upcoming Kirin 9 chip. The company will likely use new self-developed small cores that can enhance the power efficiency of its future devices.

New Huawei Kirin 9 chip could boost power consumption efficiency (Image Credits: FixedFocus/Weibo)

Further inputs reveal that the medium and large cores architecture will be unchanged. These may be the same as the previous-generation Kirin 9 series chipsets.

For reference, the medium cores maintain a balance between performance as well as energy efficiency. Meanwhile, the large cores manage heavy tasks like gaming.

It is unclear for which new device the company will use this mysterious Kirin 9 series chip. It could be for the Nova 13 series, expected to launch this month, or the standard and Pro variants of the Mate 70 series that may go official in November.

Though it’s good to see that Huawei is gradually taking new steps in upgrading its self-developed processors with better capabilities. We may find more Kirin chip enhancements and revelations on this matter in the time ahead.

New Kirin 9 chip leak (Image Credits: Weibo)

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In a recent teardown of Huawei Qingyun L540 commercial PC, the device is said to run mainly on Chinese components, implying self-reliance. It uses a self-developed Kirin 9006C 5nm chipset and the China-made Unity operating system.

According to the FinancialTimes, Huawei Qingyun L540 commercial PC is in high demand among Chinese enterprises. The government sectors and state groups are widely using the device for its high-end capabilities and performance efficiency.

Qingyun L540 PC is now also part of a Chinese localization campaign named Xinchuang (IT application innovation). This campaign is a Chinese policy that works on localizing the regional IT sector and turning down its dependency on foreign products.

The report further reveals that Chinese companies like Huawei continue to ramp up their R&D efforts in chips, machinery, and software. They believe these products are the “technological backbone” for independent, secure, and controllable supply chains.

Other than that, the Chinese firms are also supporting the native products with financial support. The Chinese government has instructed most industries to prohibit foreign goods or components usage to the maximum.

Since March 2024, many enterprises have abandoned Intel and AMD-powered laptops in favor of Huawei, Shanghai Zhaoxin, and Phytium PCs. Qingyun L540 has the largest count of orders in this context.

Notably, the idea of using Chinese products over foreign tech has resulted in a wide range of products. Chinese users and enterprise customers now have various options in the market to choose their desired technology, device, or any other product.

Automobiles

Apart from chips and software, China has directed its automakers including the European group partners to increase the use of Chinese chips. The aim is to use around 25% of Chinese chips in automobiles by the next year.

With maximum use of local components in new products and cut-off of foreign tech, China aims to gradually become more self-dependent in every technological aspect.

Qingyun L540 PC (Image Credits: Huawei)

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Tipster @FixedFocus says Huawei is testing the HarmonyOS NEXT system apps for Kirin 990 phones. The list includes some common applications for daily life tasks.

It’s pretty good news for those using a Kirin 990 model. Hearing the news, many netizens commented that the company hadn’t forgotten its old device users yet.

“I can’t believe I can use it. I cry to death. Huawei (Hasa) did not forget the old users.”

The company may have acknowledged that many users still own a Kirin 990-powered phone due to their effective features and services. Testing the HarmonyOS native apps on old devices will allow users to experience the latest software benefits.

Huawei starts testing HarmonyOS NEXT for Kirin 990 smartphones (Image Credits: Weibo)

Huawei introduced Kirin 990 chips in September 2019. It is available in 4G and 5G variants. These SoCs are present in some Huawei and Honor flagship phones from 2019-20.

For reference, Huawei devices that run on the Kirin 990 processor are the P40 series, Mate 30 series, Mate Xs, and the Nova 6 handsets. The list has both old flagship and mid-rangers that are efficient to get the HarmonyOS NEXT applications support.

The tipster further states that the recent testing progress is in full swing. It means the company would be testing apps from various streams and platforms. These apps will surely offer a smarter and safer application experience to Kirin 990 phone holders.

HarmonyOS NEXT launch preparations are in the top form. During the HC2024 event, Huawei announced over 10000 apps support HarmonyOS NEXT and claims to deliver a faster, more comprehensive, and more efficient user experience.

Native HarmonyOS apps are more reliable. They appear as a perfect alternative for Android apps. These apps come from education, entertainment, medicine, industrial, office, and more. Thus, the company aims to offer its consumers an Android-free and more beneficial app ecosystem with HarmonyOS NEXT.

HarmonyOS achieved 17 years of Android’s progress in 1 year: Huawei

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Weibo tipster @DigitalChatStation has described a new engineering model. The tipster didn’t reveal the device’s name. However, a few specs and parameters hint that the mentioned model could belong to the upcoming Mate 70 series.

Let’s check these hints one by one.

According to the details, the Mate 70 series will bring a large quad-curved display. The size is unknown but it would probably be bigger than the Pura 70 handsets.

Mate 70 could adopt a metal right-angle middle frame just like the Mate 60 flagship. This body structure is already present in the Pura 70 models. Such frames are mostly made up of aluminum alloy for a lightweight feel and beautiful texture.

The tipster further reveals a 3D face recognition technology. This time, the Mate 70 might adopt a power button fingerprint sensor instead of an in-display fingerprint sensor. This may be disappointing but hold on, as this is still a leak after all.

The back panel is said to be made up of metal-less materials. It seems the tech giant could use plain leather just like the Mate XT tri-fold, for the Mate 70 series.

Camera setup: The rear side holds a giant centered camera ring with a single periscope lens. Meanwhile, there could be a 50MP main camera and an ultra-wide lens. An upgraded XMAGE imaging system is also expected for the upcoming lineup.

The tipster says that the new chipset has greater energy efficiency and offers improved performance. Also, it can easily manage heat dissipation, overcoming the heating issues in devices. But again, this is an engineering machine and one has to wait for the actual device.

The latest input is quite in line with previous revelations of the Huawei Mate 70 series such as a big camera ring, a new chipset, and a quad-curved display. Although a clear look of the Mate 70 series will only be available by November. Stay Tuned.

Huawei Mate 70 design, camera and chipset info allegedly leaked (Image Credits: Weibo)

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